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1

First international two-way satellite time and frequency transfer experiment employing dual pseudo-random noise codes

Wen-Hung Tseng,, Yi-Jiun Huang,, Gotoh, T., Hobiger, T., Fujieda, M., Aida, M., Tingyu Li,, Shinn-Yan Lin,, Huang-Tien Lin,, Kai-Ming Feng,

Journal:

IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control

Year:

2012

Language:

english

File:

PDF, 1.02 MB

english, 2012

2

Improving TWSTFT short-term stability by network time transfer

Wen-Hung Tseng,, Shinn-Yan Lin,, Kai-Ming Feng,, Fujieda, M., Maeno, H.

Journal:

IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control

Year:

2010

Language:

english

File:

PDF, 665 KB

english, 2010

3

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

Yang, Kai-Ming, Chou, Tzu-Chieh, Ko, Cheng-Ta, Lin, Chen-Hao, Chen, Yu-Hua, Tseng, Tzyy-Jang, Wu, Wen-Wei, Chen, Kuan-Neng

Year:

2019

Language:

english

File:

PDF, 526 KB

english, 2019

4

Panel-Level Chip Scale Package with Multiple Diced Wafers

Lau, John H, Ko, Cheng-Ta, Tseng, Tzvy-Jang, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 2.84 MB

2020

5

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fan-In Panel-Level with Multiple Diced Wafers Packaging

Lau, John H, Ko, Cheng-Ta, Tseng, Tzvy-Jang, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David

Year:

2020

File:

PDF, 1.65 MB

2020

6

Sagnac Effect and Diurnal Correction on Two-Way Satellite Time Transfer

Wen-Hung Tseng, Kai-Ming Feng, Shinn-Yan Lin, Huang-Tien Lin, Yi-Jiun Huang, Chia-Shu Liao

Journal:

IEEE Transactions on Instrumentation and Measurement

Year:

2011

Language:

english

File:

PDF, 1019 KB

english, 2011

7

Sequential therapy achieves a higher eradication rate than standard triple therapy in Taiwan

Feng-Woei Tsay, Hui-Hwa Tseng, Ping-I Hsu, Kai-Ming Wang, Ching-Chang Lee, Shiuh-Nan Chang, Huay-Min Wang, Hsien-Chung Yu, Wen-Chi Chen, Nan-Jing Peng, Kwok-Hung Lai, Deng-Chyang Wu

Journal:

Journal of Gastroenterology and Hepatology

Year:

2012

Language:

english

File:

PDF, 154 KB

english, 2012

8

Porous Metal–Organic Frameworks with Multiple Cages Based on Tetrazolate Ligands: Synthesis, Structures, Photoluminescence, and Gas Adsorption Properties

Tseng, Tien-Wen, Luo, Tzuoo-Tsair, Chen, She-Yu, Su, Chong-Cheng, Chi, Kai-Ming, Lu, Kuang-Lieh

Journal:

Crystal Growth & Design

Year:

2013

Language:

english

File:

PDF, 1.26 MB

english, 2013

9

Influence of oriented topological defects on the mechanical properties of carbon nanotube heterojunctions

Lee, Wen-Jay, Chang, Jee-Gong, Yang, An-Cheng, Wang, Yeng-Tseng, Su, Wan-Sheng, Wang, Cai-Zhuang, Ho, Kai-Ming

Journal:

Journal of Applied Physics

Year:

2013

Language:

english

File:

PDF, 920 KB

english, 2013

10

[IEEE 2008 IEEE International Frequency Control Symposium - Honolulu, HI (2008.05.19-2008.05.21)] 2008 IEEE International Frequency Control Symposium - Analysis of the Asia-Pacific TWSTFT network

Wen-Hung Tseng,, Shinn-Yan Lin,, Kai-Ming Feng,

Year:

2008

Language:

english

File:

PDF, 469 KB

english, 2008

11

[IEEE 2012 IEEE International Frequency Control Symposium (FCS) - Baltimore, MD, USA (2012.05.21-2012.05.24)] 2012 IEEE International Frequency Control Symposium Proceedings - Influence of fiber delay fluctuation on a reference injection-locked optoelectronic oscillator

Tseng, Wen-Hung, Feng, Kai-Ming

Year:

2012

Language:

english

File:

PDF, 787 KB

english, 2012

12

[IEEE 2011 Joint conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) - San Francisco, CA, USA (2011.05.2-2011.05.5)] 2011 Joint Conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) Proceedings - Monitoring of opto-electronic oscillator fiber delay by a probe-signal method

Tseng, Wen-Hung, Feng, Kai-Ming

Year:

2011

Language:

english

File:

PDF, 315 KB

english, 2011

13

Enhanced light output of vertical GaN-based LEDs with surface roughened by refractive-index-matched Si 3 N 4 /GaN nanowire arrays

Tu, Yung-Chun, Wang, Shui-Jinn, Lin, Guan-Yu, Lin, Tseng-Hsing, Hung, Chien-Hsiung, Tsai, Fu-Shou, Uang, Kai-Ming, Chen, Tron-Min

Journal:

Applied Physics Express

Year:

2014

Language:

english

File:

PDF, 891 KB

english, 2014

14

Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging

Chang, Ming, Deka, Juti Rani, Tseng, Kai-Ming

Journal:

Nondestructive Testing And Evaluation

Year:

2008

Language:

english

File:

PDF, 424 KB

english, 2008

15

[IEEE 2009 Joint Meeting of the European Frequency and Time Forum (EFTF) and the IEEE International Frequency Control Symposium (FCS) - Besancon, France (2009.04.20-2009.04.24)] 2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum - The comparison between TWSTFT and GPS time transfer result of PTB-TL LINK

Lin, Shinn-Yan, Tseng, Wen-Hung, Lin, Huang-Tien, Feng, Kai-Ming, Piester, Dirk

Year:

2009

Language:

english

File:

PDF, 495 KB

english, 2009

16

[IEEE 2011 Joint conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) - San Francisco, CA, USA (2011.05.2-2011.05.5)] 2011 Joint Conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) Proceedings - The Dual Pseudo-random noise TWSTFT time transfer experiment between NICT and TL

Huang, Yi-Jiun, Tseng, Wen-Hung, Lin, Shinn-Yan, Lin, Huang-Tien, Liao, Chia-Shu, Feng, Kai-Ming

Year:

2011

Language:

english

File:

PDF, 555 KB

english, 2011

17

[IEEE 2009 Joint Meeting of the European Frequency and Time Forum (EFTF) and the IEEE International Frequency Control Symposium (FCS) - Besancon, France (2009.04.20-2009.04.24)] 2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum - Improving TWSTFT short-term stability by network time transfer

Tseng, Wen-Hung, Lin, Shinn-Yan, Feng, Kai-Ming, Fujieda, Miho, Maeno, Hideo

Year:

2009

Language:

english

File:

PDF, 2.06 MB

english, 2009

18

Preparation of SiO 2 Nanotubes with Controllable Inner/Outer Diameter and Length Using Hydrothermally Grown ZnO Nanowires as Templates

Kuo, Der-Ming, Wang, Shui-Jinn, Uang, Kai-Ming, Chen, Tron-Min, Tsai, Wei-Chih, Hsu, Wen-I, Lee, Wei-Chi, Wang, Pei-Ren, Tseng, Chih-Ren

Journal:

Japanese Journal of Applied Physics

Year:

2010

File:

PDF, 1.14 MB

2010

19

Light Output Improvement of GaN-Based Light-Emitting Diodes Using Hydrothermally Grown ZnO Nanotapers

Tu, Yung-Chun, Wang, Shui-Jinn, Lin, Jia-Ching, Tsai, Fu-Shou, Lin, Tseng-Hsing, Uang, Kai-Ming, Chen, Tron-Min

Journal:

Japanese Journal of Applied Physics

Year:

2013

Language:

english

File:

PDF, 301 KB

english, 2013

20

Impact of fiber delay fluctuation on reference injection-locked optoelectronic oscillators

Tseng, Wen-Hung, Feng, Kai-Ming

Journal:

Year:

2012

Language:

english

File:

PDF, 335 KB

english, 2012

21

Enhancing long-term stability of the optoelectronic oscillator with a probe-injected fiber delay monitoring mechanism

Tseng, Wen-Hung, Feng, Kai-Ming

Journal:

Year:

2012

Language:

english

File:

PDF, 1.24 MB

english, 2012

22

Polarization-tracking-free IFoF mobile fronthaul with adaptively modulated PDM multiband DDO-OFDM

Liu, Shing-Jiuan, Yan, Jhih-Heng, Tseng, Chen-Yao, Feng, Kai-Ming

Journal:

IEEE Photonics Technology Letters

Year:

2017

Language:

english

File:

PDF, 2.36 MB

english, 2017

23

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package

Ko, Cheng-Ta, Yang, Kai-Ming, Lin, Jim-Wein, Wang, Chih-Lun, Chou, Tzu-Chieh, Yang, Yu-Tao, Yu, Ting-Yang, Chen, Yu-Hua, Chen, Kuan-Neng, Tseng, Tzyy-Jang

Year:

2017

Language:

english

File:

PDF, 1.63 MB

english, 2017

24

Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration

Yang, Yu-Tao, Chou, Tzu-Chieh, Yu, Ting-Yang, Chang, Yu-Wei, Huang, Tai-Yuan, Yang, Kai-Ming, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 1.93 MB

english, 2017

25

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration

Yang, Yu-Tao, Yu, Ting-Yang, Kuo, Shu-Chiao, Huang, Tai-Yuan, Yang, Kai-Ming, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng

Year:

2017

Language:

english

File:

PDF, 691 KB

english, 2017

26

Hydrothermal Growth of Quasi-Monocrystal ZnO Thin Films and Their Application in Ultraviolet Photodetectors

Tu, Yung-Chun, Wang, Shui-Jinn, Lin, Tseng-Hsing, Hung, Chien-Hsiung, Tsai, Tsung-Che, Wu, Ru-Wen, Uang, Kai-Ming, Chen, Tron-Min

Journal:

International Journal of Photoenergy

Year:

2015

Language:

english

File:

PDF, 3.01 MB

english, 2015

27

[IEEE 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2018.10.24-2018.10.26)] 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems

Pan, Yu-Ming, Yang, Yu-Tao, Chou, Tzu-Chieh, Yu, Ting-Yang, Yang, Kai-Ming, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng

Year:

2018

Language:

english

File:

PDF, 566 KB

english, 2018

28

[IEEE 2019 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2019.12.7-2019.12.11)] 2019 IEEE International Electron Devices Meeting (IEDM) - Non-Planarization Cu-Cu Direct Bonding and Gang Bonding with Low Temperature and Short Duration in Ambient Atmosphere

Chou, Tzu-Chieh, Yang, Kai-Ming, Li, Jian-Chen, Yu, Ting-Yang, Chung, Ying-Ting, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng

Year:

2019

Language:

english

File:

PDF, 15.72 MB

english, 2019

29

[IEEE 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC) - Fukuoka, Japan (2019.7.7-2019.7.11)] 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC) - A Tracking-free PDM Mobile Fronthaul with High SOP Perturbation Tolerance

Chen, You-Wei, Tseng, Chen-Yao, Liu, Shing-Jiuan, Feng, Kai-Ming, Chang, Gee-Kung

Year:

2019

Language:

english

File:

PDF, 1.42 MB

english, 2019

30

Investigation of Pillar-Concave Structure for Low Temperature Cu-Cu Direct Bonding in 3D/2.5D Heterogeneous Integration

Chou, Tzu-Chieh, Yang, Kai-Ming, Li, Jian-Chen, Yu, Ting-Yang, Yang, Yu-Tao, Hu, Han-Wen, Liu, Yu-Wei, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.71 MB

2020

31

Panel-Level Fan-Out RDL-first Packaging for Heterogeneous Integration

Lau, John H, Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, JJ, Huang, Po-Chun, Liu, Hsing Ning, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 2.55 MB

2020

32

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration

Lau, John H, Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, JJ, Huang, Po-Chun, Liu, Hsing Ning, Tseng, Tzvy-Jang

Year:

2020

File:

PDF, 1.55 MB

2020

33

[IEEE 2020 Opto-Electronics and Communications Conference (OECC) - Taipei (2020.10.4-2020.10.8)] 2020 Opto-Electronics and Communications Conference (OECC) - A Neural Network Based Joint CFO-SCO Equalization for OFDM-RoF in Multi-Band Mobile Fronthaul

Yan, Jhih-Heng, Tseng, Jia-Shiang, Tsai, Sheng-Chen, Feng, Kai-Ming

Year:

2020

File:

PDF, 1.52 MB

2020

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